| ltem | Capacity Range | ltem | Capacity Range |
| Max. Working Area | 1500×800mm | Solder Resist Hardness | 6H |
| Plate Thickness | 0.4-2.0mm | Thermal Shock | 288℃ /3X/10秒288℃ /3X/10s |
| Min. Letter Width | 0.20mm | On-off Testing Voltage | 10-500V |
| Min. Gap | 0.20mm | Pad Pull Strength | > 100N |
| Min. Hole Width | 0.50mm | Solder Resistance | 245℃/1X/5S 245℃/1X/5s Internal Moistness |
| Min. Resistance | 0.20mm | Warping Degree | ≤3mm |
| Aperture Tolerance | ±0.075mmNPTH:±0.05mm | Spray Tin Thickness | 1-40um |
| Hole Position Tolerance | ±0.075mm | OSP Film Thickness | 0.25-0.5um |
| Dimension Tolerance | ±0.05mm | Surface Treatment | HAL, HASL( Lead Free), OSP |
| Laminate Voltage Resistance | 4.5KV(AC) Max.4.5KV(AC) | / | / |
